25292: Electronic Circuits Design for Harsh Environments
Course Name: Electronic Circuits Design for Harsh Environments
Course Number: 25292
Prerequisite(s): -
Co-requisite(s): 25253 (CMOS Circuits Design 1)
Units: 3
Level: Postgraduate
Last Revision: Fall 2014

Description: 
This course examines environments that include high temperatures, radiation, shocks, vibrations, magnetic fields, and electrostatic discharge. The course covers the study of temperature effects on semiconductor behavior, dealing with ionizing radiation, the impact of vibrations and shocks on circuits, reliability assessment, mitigation of electrostatic discharge, and strategies for reducing electromagnetic interference in various environments.
 
Syllabus:
  • Introduction
    • Definition of Harsh Environment (high temperature, radiation, shock, and vibration)
    • Examples of harsh environment applications (Automotive electronics, Well Logging, Space Electronics)
  • High-Temperature Electronics
    • Introduction
    • Thermal behavior of semiconductors
    • Effects of high temperature on Integrated Circuits
    • Effects of high temperature on packaging
    • Effects of high temperature on PCB level
    • Thermal behavior of passive components
    • Proper technologies for high-temperature applications
  • Ionizing Radiation and Hardening
    • Introduction and definitions
    • Radiation Sources
    • Radiation physics and characteristics
    • Radiation effects on semiconductors and integrated circuits
    • Hardening methods
    • Examples of hardened products
    • Hardening test methods
  • Shock and Vibration
    • Introduction and definitions
    • Typical vibrating frequencies and amplitude in different conditions
    • Vibration effects on electronic boards
    • Natural frequency estimation
    • Methods for increasing the natural frequency of a board
    • Supporting elements and their characteristics
    • Shock
  • Reliability
    • Introduction and definitions
    • Theory of reliability
    • Statistical models
    • Lifetime estimation methods
    • Failure mechanisms in semiconductors
    • Design for reliability (methods for improving reliability)
  • Electrostatic Discharge
    • Electrostatic charge
    • Electrostatic Discharge models
    • High voltage/high current behavior of semiconductors
    • Protection circuits structures
    • Protection elements
    • Protection circuits requirements
    • High-frequency ESD protection
    • Layout of ESD protection circuits
  • Electromagnetic Compatibility
    • Electromagnetic Compatibility and Electromagnetic Interference Definition
    • Interference reduction methods in IC level
    • Interference reduction methods at the board level
    • Interference reduction methods at the system level

References:
  • R. Kirschman, High-Temperature Electronics
  • R. Remsburg, Thermal Design of Electronic Equipment
  • X. Yu, High-Temperature Bulk CMOS Integrated Circuits for Data Acquisition
  • W. J. Greig, Integrated Circuit Packaging, Assembly and Interconnections
  • S. R. McHeown, Mechanical Analysis of Electronic Packaging Systems
  • R. Tricker, S. Tricker, Environmental Requirements for Electromechanical and Electronic Equipment
  • D. S. Steinberg, Vibration Analysis for Electronic Equipment
  • A. M. Veprik, Vibration Protection of Critical Components of Electronic Equipment in Harsh Environmental Conditions
  • L. Najafizadeh, Design of Analog Circuits for Extreme Environment Applications
  • E. R. Hnatek, A Selected Practical Reliability of Electronic Equipment and Products
  • W. Lawson, The Effect of Design and Environmental Factors on The Reliability of Electronic Products


 
Last Update: 2024-07-10